Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference7 articles.
1. Proceeding of Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP–MIC);Seo,2001
2. Proc. of CMP–MIC;Lin,1999
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