Hillock growth dynamics for Ag stress migration bonding
Author:
Funder
Japan Society for the Promotion of Science
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference8 articles.
1. Diffusion–fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing
2. Mechanical properties of thin films
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4. Effects of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock growth
5. Hillock formation, hole growth and agglomeration in thin silver films
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