Impact of post via-etch cleans on mechanical reliability of W-plug vias-Reference-Cited by-同舟云学术

Impact of post via-etch cleans on mechanical reliability of W-plug vias

Published:2001-07 Issue:1 Volume:391 Page:149-156
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Obeng Y.S.,Kang S.H.,Huang J.S.,Oates A.S.,Lin X.,Obeng J.S.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference12 articles.

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2. The 36th IEEE Reliability Physics Symposium, Reno, USA, Mar 31–April 2, IEEE Reliability Physics Symposium Proceedings;Domae,1998

3. Influence of W via on the mechanism of electromigration failure in Al–0.5 Cu interconnects

4. TiN barrier integrity and volcano formation in W-plug applications

5. Handbook of Semiconductor Wafer Cleaning Technology: Science, Technology and Application;Kern,1993

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