Author:
He Yi,Moreira Brian E,Overson Alan,Nakamura Stacy H,Bider Christine,Briscoe John F
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference13 articles.
1. D.R. Halk, Surface Mount Tech. (1997) 54 Sept.
2. C.A. Harper (Ed.), Electronic Packaging & Interconnection Handbook, 2nd Edition, McGraw-Hill, New York, 1997.
3. Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip
4. J.H. Lau (Ed.), Flip Chip Technologies, McGraw-Hill, New York, 1995.
5. E. Davis, W. Harding, R. Schwartz, J. Corning, IBM J. Res. Devel. (1964) 102 April.
Cited by
89 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献