OM4 bend insensitive multi-mode fibers’ usefulness for MCM integration-Reference-Cited by-同舟云学术

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OM4 bend insensitive multi-mode fibers’ usefulness for MCM integration

Published:2012-09 Issue:15 Volume:177 Page:1367-1372
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Guzowski Bartłomiej,Lisik Zbigniew,Tosik Grzegorz,Ciupa Emilia

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. International Technology Roadmap of Semiconductor 2010 Edition. http://public.itrs.net/.

2. Proposed IEC 60793-2-10 edition 5, Pondillo and Kuyt, IEC SC86A WG1 contribution WU-22, April 2010.

3. SMT-compatible large-tolerance optobump interface for interchip optical interconnections;Yuzo;IEEE Transactions On Advanced Packaging,2003

4. Fully embedded board-level guided-wave optoelectronic interconnects;Chen,2000

5. Optical interconnections on PCB a killer application for VCSEL;Van Daele,2003

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Realization of optical fibers terminated with ball lenses;Bulletin of the Polish Academy of Sciences Technical Sciences;2016-06-01

2. The integration of optical interconnections on ceramic substrates;Microelectronic Engineering;2016-05

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