Laser thermal processing using an optical coating for ultra shallow junction formation-Reference-Cited by-同舟云学术

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Laser thermal processing using an optical coating for ultra shallow junction formation

Published:2004-12 Issue: Volume:114-115 Page:105-108
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Hernandez M.,Venturini J.,Berard D.,Kerrien G.,Sarnet T.,Débarre D.,Boulmer J.,Laviron C.,Camel D.,Santailler J.-L.,Akhouayri H.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. The International Technology Roadmap for Semiconductors, 2003, http://public.itrs.net.

2. Transient enhanced diffusion after laser thermal processing of ion implanted silicon

3. R. Lindsay, B. Pawlak, J. Kittl, K. Henson, C. Torregiani, S. Giangrandi, R. Surdeanu, W. Vandervorst, A. Mayur, J. Ross, S. McCoy, J. Gelpey, K. Elliott, X. Pages, A. Satta, A. Lauwers, P. Stolk, K. Maex, in: T.J. Kin, Al (Eds.), MRS Proceedings, vol. 765, Mater. Res. Soc. Symp. D (2003) D7.4.

4. Ultra-shallow junction formation by excimer laser annealing and low energy (<1 keV) B implantation: A two-dimensional analysis

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