Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performances for n-type BiTeSe alloy by multi-pass equal channel angular extrusion-Reference-Cited by-同舟云学术

Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performances for n-type BiTeSe alloy by multi-pass equal channel angular extrusion

Published:2021-01 Issue: Volume:263 Page:114846
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Hu Xiaoming,Fan Xi'an,Feng Bo,Kong Dong,Liu Peihai,Xu Chenhui,Kuang Zhixiang,Li Guangqiang,Li Yawei

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference55 articles.

1. Nanostructured thermoelectrics

2. Bismuth telluride compounds with high thermoelectric figures of merit

3. Growth and investigation of thermoelectric properties of Bi–Sb alloy single crystals

4. Chemical bonding in bismuth telluride

5. ZnO nanosheets-decorated Bi2WO6 nanolayers as efficient photocatalysts for the removal of toxic environmental pollutants and photoelectrochemical solar water oxidation

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