Lead-free photoimageable silver conductor paste formulation for high density electronic packaging-Reference-Cited by-同舟云学术

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Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Published:2006-07 Issue:1-2 Volume:132 Page:215-221
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Ketkar Supriya A.,Umarji Govind G.,Phatak Girish J.,Ambekar Jalindar D.,Rao I.C.,Mulik Uttam P.,Amalnerkar Dinesh P.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. John H. Lau, S.W. Ricky Lee, 1st ed., Microvias, McGraw Hill, 2001.

2. Photoimageable silver paste for high density interconnection technology

3. Effect of glass content variation on properties of photoimageable silver conductor paste

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silver–Organic Complex in Photosensitive Silver Pastes for Enhanced Resolution and Aspect Ratio;Langmuir;2024-08-13

2. Influences of Tellurite Glass Frits on the Electrical Properties of Silicon Solar Cells;Journal of Physics: Conference Series;2023-01-01

3. Effect of solid content on performance of conductive silver paste for crystalline silicon solar cells;International Journal of Materials Research;2012-07-01

4. A Lead Free Graphite Conducting Paste for Screen Printing;Advanced Materials Research;2011-07

5. Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites;Journal of Applied Polymer Science;2011-02-25

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