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A model of the surface binding energy for fcc copper-nickel alloy

  • Published:1983-05 Issue: Volume:209-210 Page:57-61
  • ISSN:0167-5087
  • Container-title:Nuclear Instruments and Methods in Physics Research
  • language:en
  • Short-container-title:Nuclear Instruments and Methods in Physics Research

Author:

William Reynolds G.

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

1. Treatise on materials science and technology,1980

2. Sputtering by ion bombardment;Sigmund,1980

3. Sputtering by ion bombardment;Anderson,1980

4. On the sputtering of binary compounds

5. A model for surface layer composition changes in sputtered alloys and compounds

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surface binding energies of alloys: a many-body approach;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1994-05

2. Sputtering of compound semiconductor surfaces. I. Ion-solid interactions and sputtering yields;Critical Reviews in Solid State and Materials Sciences;1994-01

3. The sputter behaviour of vanadium silicide studied by a computer simulation technique;Solid State Communications;1986-11

4. Modeling the development of the component surface fractions of polycrystalline metals during ion implantation;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1986-03

5. IMPLNT — A fortran program to calculate the distribution of implanted ions which includes the effects due to sputtering;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1986-03
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