Systematic assessment of the silk deterioration behaviors for silk aging prediction
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics
Reference38 articles.
1. Silk fibroin: structural implications of a remarkable amino acid sequence;Zhou;Proteins,2001
2. Phenomenological models of Bombyx mori silk fibroin and their mechanical behavior using molecular dynamics simulations;Patel;Mater. Sci. Eng. C Mater. Biol. Appl.,2020
3. Characterization of the secondary structure of degummed Bombyx mori silk in modern and historical samples;Badillo-Sanchez;Polymer Degrad. Stab.,2018
4. Structural and mechanical properties of silk from different instars of Bombyx mori;Peng;Biomacromolecules,2019
5. Hydrophobic interaction of P25, containing Asn-linked oligosaccharide chains, with the HL complex of silk fibroin produced by Bombyx mori;Tanaka;Insect Biochem. Mol. Biol.,1999
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reinforcing and protecting leather-based relics using gelatin/tannic acid composites;International Journal of Biological Macromolecules;2024-10
2. Investigation of the Structural Changes in Silk Due to Tin Weighting;Polymers;2024-08-30
3. Unveiling the Impact of Acetic Acid: Multi-Analytical Assessment for Characterizing Accelerated Aging in Raw Silk and Sappanwood-Dyed Silk;Journal of Natural Fibers;2024-07-26
4. Shedding light on the composition and fading mechanisms of dye molecules in Phellodendron amurense Rupr. Dyed silk;Journal of Photochemistry and Photobiology A: Chemistry;2024-06
5. Study on the photodegradation behaviors of thermal-aged silk;Heritage Science;2024-05-14
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3