Thermal stability of high temperature epoxy adhesives by thermogravimetric and adhesive strength measurements
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics
Reference13 articles.
1. Kinetic parameters from thermogravimetric data;Coats;Nature,1964
2. A quick, direct method for the determination of activation energy from thermogravimetric data;Flynn;Journal of Polymer Science Part B: Polymer Letters,1966
3. Generalized composite degradation kinetics for polymeric systems under isothermal and nonisothermal conditions;Nam;Journal of Polymer Science Part B: Polymer Physics,1992
4. Degradation kinetics applied to lifetime predictions of polymers;Flynn,1980
5. Lifetime prediction for polymers from thermal analytical experiments - problems and how to deal with some of them;Flynn;Thermochimica Acta,1988
Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mechanical characterisation and high temperature analysis of hyperelastic adhesives – Modelling and experimental validation;Composite Structures;2024-11
2. Effect of Adhesive Layer Thickness on Strength of Carbon-Fiber-Reinforced Plastic/Aluminum Bond-Riveted Joints;Journal of Aircraft;2024-06-25
3. Effects of High Temperature and Different Salt Solutions on Basalt Fiber-Reinforced Composites’ Bonded Joint Durability Impact;Coatings;2023-11-13
4. Long‐term performance of single‐lap joints: Review, challenges and prospects in civil engineering;Engineering Reports;2023-09-19
5. Epoxy-based reflective adhesive for lamination of single-sided metallized film over glass fabric destined for its use as reflective layer in fire proximity clothing;Polymer Degradation and Stability;2023-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3