Novel heat-resistant and organosoluble poly(amide-imide)s containing laterally-attached phenoxy phenylene groups
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics
Reference19 articles.
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3. Preparation and properties of new thermally stable poly(ether imide amide)s;Mehdipour-Ataei;Polym Int,2004
4. Thin films from new poly(imide-ether-amide)s containing hexafluoroisopropylidene groups;Hamciuc;Macromol Mater Eng,2000
5. Synthesis, characterization and fluorimetric studies of novel photoactive poly(amide-imide) from anthracene 9-carboxaldehyde and 4,4′-diaminodiphenyl ether by microwave irradiation;Khoee;Eur Polym J,2007
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1. Poly(amide-imide)/modified-TiO2 nanocomposites containing laterally-attached benzimidazole moieties: preparation, morphological, and thermal characterization;Composite Interfaces;2022-06-18
2. Progress in designing poly(amide imide)s (PAI) in terms of chemical structure, preparation methods and processability;European Polymer Journal;2016-11
3. Synthesis and characterization of heat-resistant and soluble poly(amide-imide)s from unsymmetrical dicarboxylic acid containing 2-(triphenyl phosphoranylidene) moiety and various aromatic diamines;Journal of Chemical Sciences;2015-04
4. Facile synthesis of new thermally stable and organosoluble polyamide-imides based on non-coplaner phosphorus and silicon containing amines;Journal of Chemical Sciences;2014-11
5. Effects of the structures of end groups of pendant polydimethylsiloxane attached to a polyurethane copolymer on the low temperature toughness;Polymer Engineering & Science;2014-10-28
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