An improved unit circuit model for transient heat conduction performance analysis and optimization in multi-layer materials-Reference-Cited by-同舟云学术

An improved unit circuit model for transient heat conduction performance analysis and optimization in multi-layer materials

Published:2018-01 Issue: Volume:129 Page:1551-1562
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

He Ke-Lun,Chen Qun^ORCID,Dong En-fu,Ge Wei-Chun,Hao Jun-Hong,Xu Fei

Funder

National Key Research and Development Program of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference22 articles.

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