Microheat exchanger for cooling high power laser diodes-Reference-Cited by-同舟云学术

Microheat exchanger for cooling high power laser diodes

Published:2015-11 Issue: Volume:90 Page:266-273
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Datta Madhav,Choi Hae-Won

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference20 articles.

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2. M. Datta, M. McMaster, Bonded Metal and Ceramic Plates for Thermal Management of Optical and Electronic Devices. US Patent No. 8299604 (October 30, 2012).

3. Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates;Datta,2015

4. Direct bonding of copper to aluminum nitride;Entezarian;Mat. Sci. Eng.,1966

5. Mechanical behavior of metal-ceramic bonds;Tréheux;J. Phys. III Fr.,1994

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