Use of a vibrating plate to enhance natural convection cooling of a discrete heat source in a vertical channel
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference23 articles.
1. Conjugate heat transfer analysis for the passive enhancement of electronic cooling through geometric modification in a mixed convection domain;Hung;Numer. Heat Transfer Int. J. Comput. Methodol., Part A Appl.,1999
2. 3-d numerical analysis of natural convective liquid cooling of a 3×3 heater array in rectangular enclosures;Tou;Int. J. Heat Mass Transfer,1999
3. Liquid Cooling of Electronic Devices;Incropera,1999
4. Future research directions;Incropera,1988
5. Experimental investigation of the thermal performance of piezoelectric fans;Acikalin;Heat Transfer Eng.,2004
Cited by 45 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Comprehensive Review of Electronic Cooling Technologies in Harsh Field Environments: Obstacles, Progress, and Prospects;Journal of Mines, Metals and Fuels;2024-09-04
2. Artificial intelligence approach in mixed convection heat transfer under transverse mechanical vibrations in a rectangular cavity;Ain Shams Engineering Journal;2024-08
3. Thermal and fluid aspects of dual piezoelectric jet pump of double chambers;Applied Thermal Engineering;2024-05
4. Enhancing heat transfer using flow-induced oscillations of a flexible baffle attached to a vertical heated flat surface;International Journal of Thermal Sciences;2023-12
5. Numerical and Experimental Study on Heat Transfer Characteristics of Single Vibrating Blade in a Channel Flow;Journal of Thermal Science;2023-04-20
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3