Thermal control of temperature-sensitive electronic components using a vapor chamber integrated with a straight fins heat sink: An experimental investigation-Reference-Cited by-同舟云学术

Thermal control of temperature-sensitive electronic components using a vapor chamber integrated with a straight fins heat sink: An experimental investigation

Published:2022-11 Issue: Volume:217 Page:119147
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Rezk Khaled,Abdelrahman M.A.^ORCID,Attia Ahmed A.A.,Emam Mohamed^ORCID

Funder

Benha University

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference32 articles.

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3. V. Lakshminarayanan, N. Sriraam, The effect of temperature on the reliability of electronic components, in: IEEE CONECCT 2014 - 2014 IEEE Int. Conf. Electron. Comput. Commun. Technol., 2014, pp. 1–6. https://doi.org/10.1109/CONECCT.2014.6740182.

4. Cooling of electronic equipment;Bickley;Electron. Power UK,1983

5. Cooling Performance of Heat Sinks Used in Electronic Devices;Mjallal;MATEC Web Conf.,2018

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