Experimental and numerical investigation on the heat transfer enhancement for Mini-channel heat sinks with tessellated fins-Reference-Cited by-同舟云学术

Experimental and numerical investigation on the heat transfer enhancement for Mini-channel heat sinks with tessellated fins

Published:2022-07 Issue: Volume:211 Page:118353
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Cao Xin,Liu Huan-ling,Shao Xiao-dong,Shi Hang-bo

Funder

Natural Science Foundation of Shanghai

Higher Education Discipline Innovation Project

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference43 articles.

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4. Numerical study on heat transfer performance using Al2O3/water nanofluids in six circular channel heat sink for electronic chip;Mukesh Kumar;Mater. Today: Proc.,2020

5. Numerical simulation of heat sink cooling in the mainboard chip of a computer with temperature dependent thermal conductivity;Zaretabar;Appl. Therm. Eng.,2018

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