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Numerical investigation of flow boiling heat transfer in manifold microchannels

  • Published:2022-11 Issue: Volume:217 Page:119268
  • ISSN:1359-4311
  • Container-title:Applied Thermal Engineering
  • language:en
  • Short-container-title:Applied Thermal Engineering

Author:

Yuan Yi,Chen Li,Zhang Chuangde,Li Xiaoyu,Tao Wen-Quan

Funder

National Key Research and Development Program of China

Fundamental Research Funds for the Central Universities

Ministry of Science and Technology of the People's Republic of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference59 articles.

1. Prospects of heat transfer approaches to dissipate high heat fluxes: opportunities and challenges;Sefiane;Appl. Therm. Eng.,2022

2. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981

3. Experimental study on laminar heat transfer in microchannel heat sink;Lee,2002

4. Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink;Qu;Int. J. Heat Mass Transf.,2002

5. Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging;Fedorov;Int. J. Heat Mass Transf.,2000

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