Compact thermal modeling methodology for predicting skin temperature of passively cooled devices

Author:

Merrikh Ali Akbar

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference27 articles.

1. Thermal challenges in next-generation electronic systems;Garimella;IEEE Trans. Compon. Packag. Manuf. Technol.,2008

2. Four decades of research on thermal contact, gap, and joint resistance in microelectronics;Yovanovich;IEEE Trans. Compon. Packag. Manuf. Technol.,2005

3. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014

4. Ergonomics of the Thermal Environment – Methods for the Assessment of Human Responses to Contact with Surfaces, Part 1: Hot Surfaces,2006

5. Quantitative somatosensory testing of warm and heat-pain thresholds: the effect of body region and testing method;Defrin;Clin. J. Pain,2006

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