Author:
Jeong Su-Heon,Nam Sung-Ki,Nakayama Wataru,Lee Sun-Kyu
Funder
National Research Foundation of Korea (NRF)
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference18 articles.
1. Thermal challenges in next generation electronic systems – summary of panel presentations and discussions, components and packaging technologies;Garimella;IEEE Transactions,2002
2. Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins;Hosseinizadeh;Applied Thermal Engineering,2011
3. Heat transfer enhancement analysis of a cylindrical surface by a piezoelectric fan;Lin;Applied Thermal Engineering,2013
4. Design and fabrication of synthetic air-jet micropump;Choi;International Journal of Precision Engineering and Manufacturing,2011
5. Numerical analysis and experimental verification on thermal fluid phenomena in a vapor chamber;Koito;Applied Thermal Engineering,2006
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献