Investigation of PCM-assisted heat pipe for electronic cooling
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference45 articles.
1. Miniature loop heat pipes for electronics cooling;Pastukhov;Appl. Therm. Eng.,2003
2. Heat pipe cooling technology for desktop PC CPU;Kim;Appl. Therm. Eng.,2003
3. Development of a chip-integrated micro cooling device;Darabi;Microelectron. J.,2003
4. Steady-state and transient performance of a miniature loop heat pipe;Chen;Int. J. Therm. Sci.,2006
5. Advances in mesoscale thermal management technologies for microelectronics;Garimella;Microelectron. J.,2006
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