Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology,Fluid Flow and Transfer Processes,Mechanical Engineering
Reference67 articles.
1. Present and futuristic military applications of nanodevices;Kharat;Synth. React. Inorganic, Met. Nano-Metal Chem.,2006
2. A. Cavalcanti, W.W. Wood, L.C. Kretly, B. Shirinzadeh, Computational nanomechatronics: a pathway for control and manufacturing nanorobots, in: Int. Conf. Comput. Intell. Model. Control Autom. Technol. Internet Commer., IEEE, Sydney, Australia, 2006, pp. 4–9, doi: 10.1109/CIMCA.2006.74.
3. Experimental and numerical investigation into the influence of chip-on-film package on component operating temperature in natural convection;Liu;IEEE Trans. Device Mater. Reliab.,2014
4. R.L.L. McCullough, J.L. Wayt, J.N. Butch, US 6127038, 2000.
5. An overview to integrated power module design for high power electronics packaging;Lostetter;Microelectron. Reliab.,2000
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献