1. Recent advances and trends in advanced packaging;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2022
2. RF-SoC-expectations and required conditions;Matsuzawa;IEEE Trans. Microw. Theory Tech.,2002
3. Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform;Miao,2013
4. Design and numerical investigations of natural convection heat transfer of a new rippling fin shape;El Ghandouri;Appl. Therm. Eng.,2020
5. A combined liquid cold plate and heat sink based hybrid cooling approach for the temperature control of integrated circuit chips;Patil;J. Therm. Sci. Eng. Appl.,2022