A novel cascaded thin-film thermoelectric cooler for on-chip hotspot cooling-Reference-Cited by-同舟云学术

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A novel cascaded thin-film thermoelectric cooler for on-chip hotspot cooling

Published:2023-08 Issue: Volume:231 Page:120968
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Gong Tingrui^ORCID,Li Lianghui,Shi Maolin,Hou Gu,Kang Lingfeng,Gao Lei,Li Juntao

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology,Fluid Flow and Transfer Processes,Mechanical Engineering

Reference35 articles.

1. Characterization of the thermal properties of chemical vapor deposition grown diamond films for electronics cooling;Malcolm,2016

2. Achieving the best thermal performance for GaN-on-diamond;Pomeroy,2013

3. Electrical and thermal performance of AlGaN/GaN HEMTs on diamond substrate for RF applications;Dumka,2013

4. Thermal modeling of diamond-based power electronics packaging;Fabis,1999

5. Thermoelectric cooling materials;Mao;Nat. Mater.,2021

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1. A novel characteristic curve for thermoelectric cooler application in realistic thermal circumstances: Theory and experiment;Materials Today Physics;2024-09

2. Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management;Applied Thermal Engineering;2024-08

3. Multi-objective optimization of a porous diverter plate for a liquid-cooled micro-jet heat sink via surrogate modeling;Case Studies in Thermal Engineering;2024-04

4. Comprehensive Investigation of Two-Stage Thermoelectric Cooler Parameters on Its Performance;Arabian Journal for Science and Engineering;2023-12-20

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