A novel ultra-thin vapor chamber with composite wick for portable electronics cooling-Reference-Cited by-同舟云学术

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A novel ultra-thin vapor chamber with composite wick for portable electronics cooling

Published:2023-05 Issue: Volume:226 Page:120340
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Yan Caiman,Li Hongming,Tang Yong,Ding Xinrui,Yuan Xuepeng,Liang Yifu,Zhang Shiwei

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference49 articles.

1. Co-designing electronics with microfluidics for more sustainable cooling;Van Erp;Nature,2020

2. Opportunities and challenges in micro- and nano-technologies for concentrating photovoltaic cooling: a review;Micheli;Renew. Sustain. Energy Rev.,2013

3. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling;Tang;Appl. Energy,2018

4. Graphene film for thermal management: a review;Huang;Nano Mater. Sci.,2021

5. Superior thermal conductivity of single-layer graphene;Alexander;Nano Lett.,2008

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4. 3D lattice Boltzmann simulation of vapor chambers with dimensions approaching capillary length;International Communications in Heat and Mass Transfer;2024-11

5. A novel coaxial heat pipe with an inner vapor tube for cooling high power electronic devices;Applied Thermal Engineering;2024-10

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