Author:
Liu Wangyu,Gou Jingren,Luo Yuanqiang,Zhang Min
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province, China
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference16 articles.
1. K.S. Yang, T.Y. Yang, C.W. Tu, C.T. Yeh, M.T. Lee, A novel flat polymer heat pipe with thermal-via for cooling electronic devices, in: Iftomm World Congress, vol. 100, National Taiwan University, pp. 37–44.
2. Application of two-phase vapor chamber technique for hard disk drive cooling of pcs;Naphon;Int. Commun. Heat Mass Transfer,2013
3. A novel wick structure of vapor chamber based on the fractal architecture of leaf vein;Peng;Int. J. Heat Mass Transfer,2013
4. Experimental investigation of vapor chambers with different wick structures at various parameters;Li;Exp. Therm. Fluid Sci.,2016
5. Multi-artery heat-pipe spreader: lateral liquid supply;Hwang;Int. J. Heat Mass Transfer,2011
Cited by
39 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献