Author:
Kumar Ritesh,Tiwary Badyanath,Singh Pawan Kumar
Funder
Department of Science and Technology (SERB), India
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference49 articles.
1. Rodgers, P., Eveloy, V., & Pecht, M. G. (2005, March). Limits of air-cooling: Status and challenges. InSemiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.(pp. 116-124). IEEE.
2. A new scheme for reducing pressure drop and thermal resistance simultaneously in microchannel heat sinks with wavy porous fins;Lu;Int. J. Heat Mass Transf.,2017
3. Forced convective heat transfer across a pin fin micro heat sink;Peles;Int. J. Heat Mass Transf.,2005
4. Multi-objective optimization of a double-layered microchannel heat sink with temperature-dependent fluid properties;Kulkarni;Appl. Therm. Eng.,2016
5. An improved design of double-layered microchannel heat sink with truncated top channel;Leng;Appl. Therm. Eng.,2015
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献