Improving thermal performance of microchannels by combining rectangular pin with chamber-Reference-Cited by-同舟云学术

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Improving thermal performance of microchannels by combining rectangular pin with chamber

Published:2021-03 Issue: Volume:186 Page:116373
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Hassani S.M.,Khoshvaght-Aliabadi M.,Mazloumi S.H.,Rehman Shafiqur,Alimoradi Ashkan

Funder

Ferdowsi University of Mashhad

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference41 articles.

1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981

2. Thermal characteristics of CPU cooling by using a novel porous heat sink and nanofluids;Neyestani;J. Therm. Anal. Calorim.,2019

3. Develop the lattice Boltzmann method to simulate the slip velocity and temperature domain of buoyancy forces of FMWCNT nanoparticles in water through a micro flow imposed to the specified heat flux;Karimipour;Physica A,2018

4. A modified two-phase mixture model of nanofluid flow and heat transfer in a 3-D curved microtube;Akbari;Adv. Powder Technol.,2016

5. Enhancement of laminar forced convection cooling in wavy heat sink with rectangular ribs and Al2O3/water nanofluids;Khoshvaght-Aliabadi;Exp. Therm Fluid Sci.,2017

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