Analysis of a platform for thermal management studies of microelectronics cooling methods-Reference-Cited by-同舟云学术

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Analysis of a platform for thermal management studies of microelectronics cooling methods

Published:2013-10 Issue:1-2 Volume:60 Page:88-95
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Tigner Julaunica,Sedeh Mahmoud Moeini,Sharpe Trena,Bufford Alexandria,Floyd-Smith Tamara

Funder

US Department of Energy

National Aeronautics and Space Administration (NASA) Science and Technology Institute

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference31 articles.

1. Nano and micro technology-based next-generation package-level cooling solutions;Prasher;Intel Technology Journal,2005

2. Advances in mesoscale thermal management technologies for microelectronics;Garimella;Microelectronics Journal,2006

3. Heat transfer and fluid flow characteristics in microchannels heat exchanger using nanofluids: a review;Mohammed;Renewable and Sustainable Energy Reviews,2011

4. On-chip two-phase cooling of datacenters: cooling system and energy recovery evaluation;Marcinichen;Applied Thermal Engineering,2012

5. Nanofluid as a coolant for electronic devices (cooling of electronic devices);Ijam;Applied Thermal Engineering,2012

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