1. S. Wen, G.Q. Lu, Finite-element modeling of thermal and thermal–mechanical behavior for three-dimensional packaging of power electronics modules, in: International Society Conference on Thermal Phenomena, Las Vegas, Nevada, 2000, pp. 303–309.
2. A precise model for simulation of temperature distribution in power modules;Geng;Chinese Journal of Semiconductors,2001
3. Noise and cooling in electronics packages;Lyon;IEEE Transactions on Components and Packaging Technologies,2006
4. High-end server low-temperature cooling;Schmidt;IBM Journal of Research and Development,2002
5. Packaging technology for high performance CMOS server Fujitsu GS8900;Fujisaki;IEEE Transactions Advanced Packaging,2001