Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger-Reference-Cited by-同舟云学术

Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger

Published:2016-09 Issue: Volume:108 Page:1409-1417
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Chen Minghui,Sun Xiaodong,Christensen Richard N.,Skavdahl Isaac,Utgikar Vivek,Sabharwall Piyush

Funder

U.S. Department of Energy Office of Nuclear Energy’s Nuclear Energy University Programs

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference19 articles.

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2. Process Heat Exchanger Options for the Advanced High Temperature Reactor;Sabharwall,2011

3. Design, Fabrication, Performance Testing, and Modeling of Diffusion Bonded Compact Heat Exchangers in a High-temperature Helium Test Facility;Mylavarapu,2011

4. Fundamentals of Heat Exchanger Design;Shah,2003

5. Heatric, (accessed 25.12.15).

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