Research on heat transfer and flow distribution of parallel-configured microchannel heat sinks for arrayed chip heat dissipation
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference44 articles.
1. Experimental study on flow boiling in ultrahigh-aspect-ratio copper microchannel heat sink;Cui;Appl. Therm. Eng.,2023
2. A novel microchannel heat sink with staggered inlet and outlet to improve base surface temperature uniformity;Li;Appl. Therm. Eng.,2024
3. Experimental investigation into flow boiling heat transfer and pressure drop in porous coated microchannels;Zhang;Int. J. Heat Mass Transf.,2024
4. Flow boiling instability and pressure drop characteristics based on micro-pin-finned surfaces in a microchannel heat sink;Ma;Int. J. Heat Mass Transf.,2022
5. Numerical simulation of heat transfer of two-phase flow in mini-channel heat sink and investigation the effect of pin-fin shape on flow maldistribution;Khdair;Eng. Anal. Bound. Elem.,2023
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