Author:
He Xuehao,Yan Wentao,Wang Shuangfeng
Funder
National Natural Science Foundation of China
Reference26 articles.
1. Q. Li, A. Han, G. Yang, Y. Hong, Z. Zhang, L. Jin, J. Yang, Technical challenges and novel passive cooling technologies for ultra-thin notebooks, in: 2017 16th IEEE Intersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst. ITherm, IEEE, Orlando, FL, 2017, pp. 1069–1074.
2. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling;Tang;Appl. Energy,2018
3. A critical review of traditional and emerging techniques and fluids for electronics cooling;Sohel Murshed;Renew. Sustain. Energy Rev.,2017
4. Skin cooling and other challenges in future mobile form factor computing devices;Mongia;Microelectron. J.,2008
5. Review and advances in heat pipe science and technology;Faghri;J. Heat Transf.,2012
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