Comparative study on topology optimization of microchannel heat sink by using different multi-objective algorithms and objective functions-Reference-Cited by-同舟云学术

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Comparative study on topology optimization of microchannel heat sink by using different multi-objective algorithms and objective functions

Published:2024-09 Issue: Volume:252 Page:123606
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Wang Jiahao^ORCID,Melideo Daniele,Liu Xiaomin^ORCID,Desideri Umberto^ORCID

Publisher

Elsevier BV

Reference67 articles.

1. Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux;Sun;Heat Mass Transf.,2022

2. C. Bailey Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools. 10th Electronics Packaging Technology Conference (2008) 527–532.

3. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review;He;Energy,2021

4. Frontier of heat transfer - microscale heat transfer;Guo;Adv. Mech.,2000

5. 3D study of convection-radiation heat transfer of electronic chip inside enclosure cooled by heat sink;Hassan;Int. J. Therm. Sci.,2021

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