Author:
Cheng Y.P.,Lee T.S.,Low H.T.
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference27 articles.
1. US Air force Avionics Integrity Program notes, 1989.
2. Thermal frontiers in the design and packaging of microelectronic equipment;Bar-Cohen;Mechanical Engineering,1983
3. Convection heat transfer in electronic equipment cooling;Incropera;ASME Journal of Heat Transfer,1988
4. Review of heat transfer technologies in electronic equipment;Yeh;Journal of Electronic Packaging,1995
5. A review of recent developments in some practical aspects of air-cooled electronic packages;Sathe;ASME Journal of Heat Transfer,1998
Cited by
50 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献