1. High power electronic component: review;Chen;Recent Patents on Engineering,2008
2. I. Saucius, R. Prasher, J. Chang, H. Erturk, G. Chrysler, C. Chiu, R. Mahajan, Thermal performance and key challenges for future CPU cooling technologies, in: Proceeding of IPACK2005, Paper No. 73242, SanFrancisco, CA, USA, 2005.
3. Operational characteristics of a miniature loop heat pipe with flat evaporator;Singh;International Journal of Thermal Sciences,2008
4. Miniature loop heat pipes – a promising means for cooling electronics;Maydanik;IEEE Transactions on Components and Packaging Technologies,2005
5. Heat Pipes;Reay,2006