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Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

  • Published:2020-02 Issue: Volume:166 Page:114686
  • ISSN:1359-4311
  • Container-title:Applied Thermal Engineering
  • language:en
  • Short-container-title:Applied Thermal Engineering

Author:

Chen Liang,Deng Daxiang,Huang Qingsong,Xu Xinhai,Xie Yingxi

Funder

National Nature Science Foundation of China

Science and Technology Planning Project of Guangdong Province

Science and Technology Planning Project for Industry-University-Research Cooperation in Huizhou City

Guangdong Key Laboratory of Precision Equipment and Manufacturing Technique

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference47 articles.

1. Heat and fluid flow in high-power LED packaging and applications;Luo;Prog. Energy Combust. Sci.,2016

2. Thermal and optical investigations of high power LEDs with metal embedded printed circuit boards;Ding;Int. Commun. Heat Mass Transf.,2015

3. Experimental investigation on the thermal performance of three-dimensional vapor chamber for LED automotive headlamps;Lu;Appl. Therm. Eng.,2019

4. Thermal model design and analysis of the high-power LED automotive headlight cooling device;Zhao;Appl. Therm. Eng.,2015

5. Thermal challenges in the future generation solid state lighting applications: light emitting diodes;Arik,2002

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