An experimental study on flow boiling in microchannels under heating pulses and a methodology for predicting the wall temperature fluctuations
Author:
Funder
CAPES
CNPq
FAPESP
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference40 articles.
1. High flux heat removal with microchannels—a roadmap of challenges and opportunities;Kandlikar;Heat Transfer Eng.,2005
2. Recent advances in high-flux, two-phase thermal management;Mudawar;J. Therm. Sci. Eng. Appl.,2013
3. State of the art of high heat flux cooling technologies;Agostini;Heat Transfer Eng.,2007
4. Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with non-uniform heat flux;Kim;J. Heat Transfer,2010
5. A novel concentrator photovoltaic (CPV) system with the improvement of irradiance uniformity and the capturing of diffuse solar radiation;Tien;Appl. Sci.,2016
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental investigation on boiling heat transfer performance of fractal microchannels for high heat dissipation applications;Case Studies in Thermal Engineering;2023-12
2. Enhanced heat transfer using wafer-scale crack-free well-ordered porous structure surface;International Communications in Heat and Mass Transfer;2023-11
3. Numerical investigation on boiling mechanism under periodic wave pulse heating by lattice Boltzmann;Case Studies in Thermal Engineering;2022-07
4. Flow Boiling;Mechanical Engineering Series;2021
5. Flow boiling heat transfer of R134a in a 500 µm ID tube;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2020-04-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3