Numerical study on flow and heat transfer of a hybrid microchannel cooling scheme using manifold arrangement and secondary channels-Reference-Cited by-同舟云学术

Numerical study on flow and heat transfer of a hybrid microchannel cooling scheme using manifold arrangement and secondary channels

Published:2019-08 Issue: Volume:159 Page:113896
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Yang Min,Cao Bing-Yang

Funder

National Nature Science Foundation of China

Science Fund for Creative Research Group

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference39 articles.

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4. Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler;Liu,2006

5. Flow and thermal modeling and optimization of micro/mini-channel heat sink;Yang;Appl. Therm. Eng.,2017

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