Experimental investigation of flat porous heat pipe for cooling TV box electronic chips

Author:

Zeghari K.,Louahlia H.,Le Masson S.

Funder

Orange Company

Manche numérique

Saint Lô Agglomeration

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference52 articles.

1. The 2004 international electronics manufacturing initiative (iNEMI) technology roadmaps;Pfahl,2005

2. A critical review of traditional and emerging techniques and fluids for electronics cooling;Sohel Murshed;Renew. Sustain. Energy Rev.,2017

3. Life cycle cost based optimization design method for an integrated cooling system with multi-operating modes;Fu;Appl. Therm. Eng.,2018

4. Best Practices for Datacom Facility Energy Efficiency;ASHRAE Technical Committee,2009

5. Current status and future trends in data-center cooling technologies;Li;Heat Transfer Eng.,2015

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