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Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments

  • Published:2019-02 Issue: Volume:148 Page:238-255
  • ISSN:1359-4311
  • Container-title:Applied Thermal Engineering
  • language:en
  • Short-container-title:Applied Thermal Engineering

Author:

Cai Yang,Wang Yu,Liu Di,Zhao Fu-Yun

Funder

Natural Science Foundation of China

Joint Zhuzhou – Hunan Provincial Natural Science Foundation

National Defense Research Funds of Wuhan University

Fundamental Research Projects from Shenzhen Council

National Key Research and Development Program of the Ministry of Science and Technology of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference101 articles.

1. Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling;Zhang,2003

2. Thermoelectric cooler application in electronic cooling;Chein;Appl. Therm. Eng.,2004

3. RETRACTED: experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package;Wang;Energy Convers. Manage.,2015

4. Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications;Zhu;Energy Conversion Management,2013

5. Thermoelectric air-cooling module for electronic devices;Chang;Appl. Therm. Eng.,2009
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