An experimental study of enhanced heat sinks for thermal management using n-eicosane as phase change material
Author:
Funder
University of Engineering and Technology, Taxila, Pakistan
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference56 articles.
1. Forced convective heat transfer across a pin fin micro heat sink;Peles;Int. J. Heat Mass Transf.,2005
2. A brief survey and economical analysis of air cooling for electronic equipments;Etemoglu;Int. Commun. Heat Mass Transf.,2007
3. System thermal analysis for mobile phone;Luo;Appl. Therm. Eng.,2008
4. A universal performance chart for CPU cooling devices;Ng;Heat Transfer Eng.,2008
5. U. Ghoshal et al., High-performance liquid metal cooling loops, in: 21st IEEE SEMI-THERM Symposium, 2005.
Cited by 132 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Numerical and experimental investigation of a phase change material radial fin heat sink for electronics cooling;Journal of Energy Storage;2024-09
2. Investigation on Cooling Performance of Composite PCM and Graphite Fin for Battery Thermal Management System of Electric Vehicles;Energy Storage;2024-09
3. Preparation, characterization, and experimental investigation of novel composite phase change material for thermal management applications;Journal of Materials Science;2024-08
4. Experimental and numerical investigation of a real-scale air to multiple PCM heat exchanger;Journal of Building Engineering;2024-07
5. Heat transfer through a three-layer wall considering the contribution of phase change: A novel approach to the modelling of the process;International Journal of Heat and Mass Transfer;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3