Author:
Wang Xiaohong,Lu Chennan,Rao Wei
Funder
National Natural Science Foundation of China
National Key Research and Development Program of China
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference137 articles.
1. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
2. ITRS, International technology roadmap for semiconductors – emerging research materials summary, 2013.
3. Novel nanostructured thermal interface materials: a review;Hansson;Int. Mater. Rev.,2018
4. Liquid metals for nuclear applications;Gorse Pomonti;J. Non-Cryst. Solids,2007
5. X.H. Yang, J. Liu, Advances in liquid metal science and technology in chip cooling and thermal management, in: E.M. Sparrow, J.P. Abraham, J.M. Gorman (Eds.), Advances in Heat Transfer, 2018, vol. 50, pp 187–300.
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