Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication-Reference-Cited by-同舟云学术

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Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication

Published:2013-04 Issue:1 Volume:53 Page:78-88
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Cheng Hsien-Chie,Ciou Wei-Ren,Chen Wen-Hwa,Kuo Jing-Lin,Lu Hsin-Chia,Wu Ruey-Beei

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference29 articles.

1. K. Nishikawa, B. Piernas, T. Nakagawa, K. Araki, K. Cho, V-band fully integrated TX/RX single-chip 3-D MMICs using commercial GaAs pHEMT technology for high speed wireless application, in: GaAs IC Symp. Dig., 2003, pp. 97–100.

2. B. Floyd, S. Reynolds, U. Pfeifer, T. Beukema, J. Grzyb, C. Haymes, A silicon 60GHz receiver and transmitter chipset for broadband communications, in: Int. Solid-State Circuit Conf. Dig., 2006, pp. 184–185.

3. S. Emami, C.H. Doan, A.M. Niknejad, R.W. Brodersen, A highly integrated 60 GHz CMOS front-end receiver, in: Proc. Int. Solid-State Circuits Conf. (ISSCC), 2007, pp. 190–191.

4. C.H. Wang, H.Y. Chang, P.S. Wu, K.Y. Lin, T.W. Huang, H. Wang, C.H. Chen, A 60 GHz low-power six-port transceiver for gigabit software-defined transceiver application, in: Proc. Int. Solid-State Circuits Conf. (ISSCC), 2007, pp. 192–193.

5. 60-GHz four-element phased-array transmit/receive system-in-package using phase compensation techniques in 65nm flip-chip CMOS process;Kuo;IEEE Transactions on Microwave Theory and Techniques,2012

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