SIMS depth profile of copper in low-k dielectrics under electron irradiation for charge compensation-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

SIMS depth profile of copper in low-k dielectrics under electron irradiation for charge compensation

Published:2003-01 Issue: Volume:203-204 Page:512-515
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Yamada K.,Fujiyama N.,Sameshima J.,Kamoto R.,Karen A.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference3 articles.

1. H. Cui, et al., in: Proceedings of the 2001 IEEE International Interconnect Technology Conference.

2. N. Matsubara, et al., in: Proceedings of the 2001 IEEE International Interconnect Technology Conference.

3. J.M. Mckinley, et al., in: Proceedings of the SIMS XII, 2000, 607 pp.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electron and Ion Beam Characterization of Glass;Springer Handbook of Glass;2019

2. Kinetics of Ion Drift;Metal-Dielectric Interfaces in Gigascale Electronics;2011-11-29

3. Experimental Techniques;Metal-Dielectric Interfaces in Gigascale Electronics;2011-11-29

4. ToF-SIMS characterization of contamination in ultra low-κ dielectric films;Surface and Interface Analysis;2010-04-22

5. The role of ultraviolet radiation during ultralow k films curing: Strengthening mechanisms and sacrificial porogen removal;Journal of Applied Physics;2007-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP