Joining of tungsten with low-activation ferritic–martensitic steel and vanadium alloys for demo reactor
Author:
Publisher
Elsevier BV
Subject
Nuclear Energy and Engineering,Materials Science (miscellaneous),Nuclear and High Energy Physics
Reference36 articles.
1. Process optimization for diffusion bonding of tungsten with EUROFER97 using a vanadium interlayer;Basuki;J. Nucl. Mater,2015
2. Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten-steel joint using a V/Cu composite barrier interlayer;Cai;Int. J. Refract. Metals Hard Mater.,2015
3. Joining of tungsten to ferritic/martensitic steels by hot isostatic pressing;Park;J. Nucl. Mater,2013
4. Joining methods of Be/FMS and W/FMS for the ITER TBM first wall;Il Jung;Fusion Eng. Des.,2011
5. Functionally graded vacuum plasma sprayed and magnetron sputtered tungsten/EUROFER97 interlayers for joints in helium-cooled divertor components;Weber;J. Nucl. Mater,2013
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