Migration and Wear of a Dual Mobility Acetabular Construct at 3 Years Measured by Radiostereometric Analysis
Author:
Publisher
Elsevier BV
Subject
Orthopedics and Sports Medicine
Reference42 articles.
1. Survival of cementless dual mobility socket with a mean 17 years follow-up;Philippot;Rev Chir Orthop Reparatrice Appar Mot,2008
2. Dual-mobility cups for revision due to instability are associated with a low rate of re-revisions due to dislocation;Hailer;Acta Orthop,2012
3. [Survival of the cementless Bousquet dual mobility cup: minimum 15-year follow-up of 437 total hip arthroplasties];Lautridou;Rev Chir Orthop Reparatrice Appar Mot,2008
4. Dual mobility cemented cups have low dislocation rates in THA revisions;Langlais;Clin Orthop Relat Res,2008
5. Use of a dual mobility socket to manage total hip arthroplasty instability;Guyen;Clin Orthop Relat Res,2009
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1. Dual Mobility Articulation in Total Hip Arthroplasty: Mixed Femoral and Acetabular Components are a Feasible Option;The Journal of Arthroplasty;2024-09
2. Migration patterns of acetabular cups: a systematic review and meta-analysis of RSA studies;Acta Orthopaedica;2023-12-29
3. Evolution and New Generation of Dual Mobility Cups;Orthopedics;2023-09
4. Five-year polyethylene cup migration and PE wear of the Anatomic Dual Mobility acetabular construct;Archives of Orthopaedic and Trauma Surgery;2023-02-21
5. Cemented and cementless dual mobility cups show similar fixation, low polyethylene wear, and low serum cobalt-chromium in elderly patients: a randomized radiostereometry study with 6 years’ follow-up;Acta Orthopaedica;2022-12-16
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