Deep Learning Artificial Intelligence Model for Assessment of Hip Dislocation Risk Following Primary Total Hip Arthroplasty From Postoperative Radiographs
Author:
Funder
NIAMS
Publisher
Elsevier BV
Subject
Orthopedics and Sports Medicine
Reference29 articles.
1. Efficacy of revision surgery for the dislocating total hip arthroplasty: report from a large community registry;Salassa;Clin Orthop Relat Res,2014
2. The epidemiology of revision total hip arthroplasty in the United States;Bozic;J Bone Joint Surg Am,2009
3. Risk factors for dislocation after primary total hip replacement: a systematic review and meta-analysis of 125 studies involving approximately five million hip replacements;Kunutsor;Lancet Rheumatol,2019
4. The functional and financial impact of isolated and recurrent dislocation after total hip arthroplasty;Abdel;Bone Joint J,2015
5. Dislocation following total hip replacement;Dargel;Deutsches Arzteblatt Int,2014
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