Abrasive processes for micro parts and structures
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference283 articles.
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3. Molecular Dynamics Investigations on Polishing of a Silicon Wafer with a Diamond Abrasive;Agrawal;Applied Physics A,2010
4. Experimental and Numerical Investigation of Ductile Regime Machining of Silicon Nitride;Ajjarapu;AIP Conference Proceedings,2004
5. A State-of-the-art Review of Ductile Cutting of Silicon Wafers for Semiconductor and Microelectronics Industries;Arif;The International Journal of Advanced Manufacturing Technology,2012
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