A novel process-linked assembly failure model for adhesively bonded composite structures-Reference-Cited by-同舟云学术

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A novel process-linked assembly failure model for adhesively bonded composite structures

Published:2017 Issue:1 Volume:66 Page:29-32
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Yazdani Nezhad Hamed,Zhao Yifan,Liddel Paul D.,Marchante Veronica,Roy Rajkumar

Funder

Institutional EPSRC Grant for Dielectric Activated Resin Cure for Composite Repair

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference9 articles.

1. On the Certification of Bonded Repairs to Primary Composite Aircraft Components;Baker;Journal of Adhesion,2015

2. Tensile Response of Adhesively Bonded Composite-to-composite Single-lap Joints in the Presence of Bond Deficiency;Bhanushali;Procedia CIRP,2017

3. Numerical Analysis of Low-velocity Rigid-body Impact Response of Composite Panels;Nezhad;International Journal of Crashworthiness,2015

4. Identification of MIMO Nonlinear Systems Using a Forward Regression Orthogonal Estimator;Billings;International Journal of Control,1989

5. Tracking Time-varying Causality and Directionality of Information Flow Using an Error Reduction Ratio Test with Applications to Electroencephalography Data;Zhao;Physical Review E,2012

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